Brief introduction about high pressure die casting for 5G use SFP transceiver case:
Die casting is a process that molten metal is injected into a metal mold under high pressure ranging from 10Mpa-210Mpa.
This special process will generate a highly uniformed casting shape with exquisite surface finish and exceptional dimensional accuracy. Normally it will greatly reduce the following machining process required to polish the component. Allwell cast can offer either the cold chamber process or the hot chamber one.
During the cold chamber process, zinc is filled into the injection chamber in every shot. There will be less exposure of the molten metal to the chamber walls and plunger. This prevents the aluminum and copper material from alloying with iron when they are at an elevated temperature.
The hot chamber technology has the injection chamber connected permanently with the die cavity immersing in the molten metal. It is often used for tin and zinc, which has lower melting point and high fluidity.
Allwell cast can offer alloys of aluminum, zinc and magnesium. And we specialize in zinc castings with thinner wall technology, which is thinner than aluminum due to high melt fluidity.
We can design and produce telecommunication related metal parts from very small to about 50 kg (110lbs ) for aluminum, 10 kg ( 22 lbs ) for magnesium, 20 kg( 176 lbs ) for zinc.
Minimum wall thickness and draft angles for die castings are as follows
Material: Aluminum
Min Thickness: 0.9 mm (0.35 in)
Min draft angle: 0.5 degrees
Material: Zinc alloys
Min Thickness: 0.01 mm (0.00039 in)
Min. draft angle: 0.25 degrees
At this stage, the packaging challenges of optoelectronic devices are facing the following issues.
- The first is how to design an efficient coupling system and temperature control system;
- the second is how to make use of packaging parasitic effect while single-tube devices are moving towards high-speed and large-bandwidth to compensates the chip’s shortcomings;
- the third is how to complete the feeding of multiple microwave signals in a limited space when the array devices are developing towards miniaturization and integration, as well as complete structural transformation and mode field matching.
We have all the optical module research and development facilities in house and we are here to cooperate with you to develop the 5G supporting products.
